JPH0256941B2 - - Google Patents
Info
- Publication number
- JPH0256941B2 JPH0256941B2 JP18476185A JP18476185A JPH0256941B2 JP H0256941 B2 JPH0256941 B2 JP H0256941B2 JP 18476185 A JP18476185 A JP 18476185A JP 18476185 A JP18476185 A JP 18476185A JP H0256941 B2 JPH0256941 B2 JP H0256941B2
- Authority
- JP
- Japan
- Prior art keywords
- scraper
- foreign matter
- wind tunnel
- tip
- vertical mill
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Crushing And Grinding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18476185A JPS6245351A (ja) | 1985-08-22 | 1985-08-22 | 竪型ミルの異物排出用スクレ−パ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18476185A JPS6245351A (ja) | 1985-08-22 | 1985-08-22 | 竪型ミルの異物排出用スクレ−パ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6245351A JPS6245351A (ja) | 1987-02-27 |
JPH0256941B2 true JPH0256941B2 (en]) | 1990-12-03 |
Family
ID=16158866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18476185A Granted JPS6245351A (ja) | 1985-08-22 | 1985-08-22 | 竪型ミルの異物排出用スクレ−パ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6245351A (en]) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7368818B2 (en) | 1994-09-20 | 2008-05-06 | Tessera, Inc. | Methods of making microelectronic assemblies including compliant interfaces |
US7408260B2 (en) | 1995-10-31 | 2008-08-05 | Tessera, Inc. | Microelectronic assemblies having compliant layers |
USRE43404E1 (en) | 1996-03-07 | 2012-05-22 | Tessera, Inc. | Methods for providing void-free layer for semiconductor assemblies |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106040366A (zh) * | 2016-07-26 | 2016-10-26 | 新乡市长城机械有限公司 | 带有预压物料和定位落料的立式辊磨机及立式辊磨方法 |
WO2024150468A1 (ja) * | 2023-01-11 | 2024-07-18 | 株式会社Ihi | 粉砕機 |
-
1985
- 1985-08-22 JP JP18476185A patent/JPS6245351A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7368818B2 (en) | 1994-09-20 | 2008-05-06 | Tessera, Inc. | Methods of making microelectronic assemblies including compliant interfaces |
US7408260B2 (en) | 1995-10-31 | 2008-08-05 | Tessera, Inc. | Microelectronic assemblies having compliant layers |
USRE43404E1 (en) | 1996-03-07 | 2012-05-22 | Tessera, Inc. | Methods for providing void-free layer for semiconductor assemblies |
Also Published As
Publication number | Publication date |
---|---|
JPS6245351A (ja) | 1987-02-27 |
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